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US 7,608,204 B2Granted
Conductive ink composition and method of forming a conductive pattern using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJang-Sub Kim, Soon-Kwon Lim, Joo-Ho Moon, Sun-Ho Jeong, Dong-Jo Kim, Kyoo-Hee Woo
Life of this patent
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Abstract
A conductive ink composition includes about 15% to about 50% by weight of copper nanoparticles, about 40% to about 80% by weight of a non-aqueous solvent mixture, about 0.01% to about 5% by weight of a dispersion agent and about 1% to about 20% by weight of a wetting agent. A conductive pattern may be formed with use of the conductive ink composition and an inkjet printer.
Claims8
A conductive ink composition comprising:
- about 40% to about 80% by weight of a non-aqueous solvent mixture comprising a first solvent having a viscosity of about 0.1 mPa·s to about 5 mPa·s at about 25° C., a second solvent having a viscosity of about 15 mPa·s to about 40 mPa·s at about 25° C., and a third solvent having a vapor pressure of about 10 mmHg to about 250 mmHg at about 25° C.;
- about 15% to about 50% by weight of copper nanoparticles;
- about 0.01% to about 5% by weight of a dispersion agent;
- and
- about 1% to about 20% by weight of a wetting agent.
2 more elements
Dependencies are inferred from the claim text.