Biased retaining ring
AssigneeApplied Materials, Inc.
InventorsAntoine P. Manens, Feng Q Liu, Paul D. Butterfield, Alain Duboust, Rashid Mavliev
Life of this patent
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Abstract
A retaining ring for electrochemical mechanical processing is described. The ring has a conductive portion having an upper surface and a lower surface and an insulating portion. The insulating portion has one or more openings extending therethrough, exposing the lower surface of the conductive portion. An upper surface of the insulating portion contacts the lower surface of the conductive portion. In an electrochemical mechanical polishing process, the retaining ring can be biased separately from a substrate being polished.
Claims23
A system for electrochemical mechanical processing, comprising:
- a polishing pad support;
- a carrier head, configured to contact the polishing pad support, the carrier head comprising:
- a base;
- and
- a retaining ring attached to the base, wherein the retaining ring comprises:
- a conductive portion having an upper surface and a lower surface;
- and
- an insulating portion having one or more openings extending through the insulating portion and exposing the lower surface of the conductive portion, wherein an upper surface of the insulating portion contacts the lower surface of the conductive portion;
- and
- a first voltage source electrically coupled to the conductive portion of the retaining ring.
Dependencies are inferred from the claim text.