Method of analyzing electrical connection and test system

A method of determining quality of an electrical connection of a compliant press-fit pin inserted into a conductive receptacle at an interface on a substrate of an electrical assembly, said method comprising the steps of:

• applying thermal energy to at least one of the compliant press-fit pin and the substrate at a location outside of the pin to receptacle interface;
• measuring thermal energy radiation near the pin to receptacle interface;
• analyzing the measured thermal energy radiation to determine thermal energy distribution near the pin to receptacle interface resulting from thermal conductivity at the interface;
• and
• determining quality of the pin to receptacle electrical connection based on the determined thermal energy distribution.

A test system for determining quality of an electrical connection between a pin and a circuit at an interface on a substrate, said test system comprising:

• a heat source for applying thermal energy to one of a pin and a substrate at a location outside of the pin to circuit interface;
• a thermal energy measuring device for measuring thermal energy radiation near the pin to circuit interface;
• and
• a processor for analyzing the measured thermal energy radiation to determine thermal energy distribution near the pin to circuit interface resulting from thermal conductivity at the interface, said processor further determining quality of the pin to circuit electrical connection based on the determined thermal energy distribution;
• wherein the test system determines quality of a compliant press-fit pin inserted into a plated through hole on the substrate.