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US 7,607,227 B2Granted
Method of forming a printhead
AssigneeEastman Kodak Company
InventorsKathleen M. Vaeth, Constantine N. Anagnostopoulos, John A. Lebens
Life of this patent
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Abstract
A method of manufacturing a printhead includes providing a polymeric substrate having a surface; providing a patterned material layer on the surface of the polymeric substrate; and removing at least some of the polymeric substrate not covered by the patterned material layer using an etching process.
Claims8
A method of manufacturing a printhead comprising:
- providing a polymeric substrate having a surface, and the polymeric substrate being provided on a patterned carrier substrate;
- providing a patterned material layer on the surface of the polymeric substrate, and the patterned material layer being a first material layer and being located between the patterned carrier substrate and the polymeric substrate;
- removing at least some of the polymeric substrate not covered by the patterned material layer using an etching process;
- providing a second material layer on a second surface of the polymeric substrate;
- patterning the second material layer;
- and
- removing the patterned carrier substrate from the second material layer, the polymeric substrate, and the first material layer.
4 more elements
A method of manufacturing a printhead comprising:
- providing a polymeric substrate on a patterned carrier substrate, the polymeric substrate having a surface;
- providing a patterned material layer on the surface of the polymeric substrate;
- removing portions of the polymeric substrate not covered by the patterned material layer using a reactive ion etching (RIE) process;
- removing said portions of the polymeric substrate not covered by the patterned carrier substrate using the reactive ion etching process;
- and
- removing the polymeric substrate from the patterned carrier substrate.
3 more elements
A method of manufacturing a printhead comprising:
- providing a polymeric substrate having a surface, and the polymeric substrate being provided on a patterned carrier substrate;
- providing a patterned material layer on the surface of the polymeric substrate, and the patterned material layer being a first material layer;
- removing at least some of the polymeric substrate not covered by the patterned material layer using an etching process;
- and
- providing a second material layer on a second surface of the polymeric substrate, and the second material layer being located between the patterned carrier substrate and the polymeric substrate;
- and
- patterning the second material layer with the etching process using the patterned carrier substrate as a mask.
4 more elements
Dependencies are inferred from the claim text.