Method of making an electronic device housing

A method of housing an electronic device, comprising:

• molding a base;
• positioning an electronic device on the base;
• over-molding a lid onto at least a portion of the base and a portion of the electronic device, the lid and the base comprising a housing for the electronic device;
• and
• over-molding a movable component to engage a portion of the housing such that the movable component is slidably attached to a portion of the housing.

A method of assembling a housing for an electronic device, comprising:

• positioning an electronic device housed within a housing in a first mold cavity of an assembly mold;
• molding a movable component in a second mold cavity of the assembly mold;
• and
• attaching the movable component to engage the housing while both the movable component and the housing are within the assembly mold such that the movable component is slidably attached to a portion of the housing.

A method for housing an electronic device, comprising:

• positioning a base within a first mold cavity of an assembly mold;
• positioning an electronic device on the base;
• over-molding a lid onto at least a portion of the base and a portion of the electronic device, the lid and the base comprising a housing for the electronic device;
• molding a movable component in a second mold cavity of the assembly mold;
• and
• attaching the movable component to engage the housing while both the movable component and the housing are within the assembly mold such that the movable component is slidably attached to a portion of the housing.

A method for housing an electronic device, comprising:

• molding a base within a first mold cavity of an assembly mold;
• positioning an electronic device on the base;
• over-molding a lid onto at least a portion of the base and a portion of the electronic device, the lid and the base comprising a housing for the electronic device;
• molding a movable component in a second mold cavity of the assembly mold;
• and
• attaching the movable component to engage the housing while both the movable component and the housing are within the assembly mold such that the movable component is slidably attached to a portion of the housing.