Dynamic measurement control

A method for operating a metrology tool, the method comprising:

• applying a default metrology operation to a test wafer;
• automatically applying a secondary metrology operation to the test wafer when any metrology data from the default metrology operation indicates a process excursion, the secondary metrology operation for at least one of confirming the process excursion, determining an extent of the process excursion, and characterizing the process excursion;
• and
• not performing the secondary metrology operation on the test wafer when the process excursion is not present.

A method for operating a metrology tool, the method comprising:

• importing a set of metrology results for a test wafer;
• applying only a default metrology operation to the test wafer when the set of metrology results does not indicate an error condition for the test wafer;
• applying a secondary metrology operation to the test wafer when the set of metrology results indicates the error condition for the test wafer, the secondary metrology operation for at least one of confirming the error condition, determining an extent of the error condition, and characterizing the error condition;
• and
• not performing the secondary metrology operation on the test wafer when the error condition is not present.

A system for measuring wafer properties, the system comprising:

• a first metrology tool for applying a first metrology operation to a first set of test wafers to generate a first set of metrology data;
• a communications network;
• and
• a second metrology tool coupled to the first metrology tool via the communications network,
• the second metrology tool being configured to apply a default metrology operation to the first set of test wafers when the first set of metrology data does not indicate an error condition for the first set of test wafers,
• the second metrology tool being further configured to apply a secondary metrology operation to one or more of the first set of test wafers when the first set of metrology data indicates the error condition for the first set of test wafers, the secondary metrology operation for at least one of confirming the error condition, determining an extent of the error condition, and characterizing the error condition.

A computer system for communicating with a first metrology tool and a second metrology tool, the computer system comprising:

• means for receiving metrology data associated with a set of test wafers from the first metrology tool;
• means for generating an error indicator signal only when the metrology data associated with the set of test wafers deviates from expected results;
• and
• means for providing the error indicator signal to the second metrology tool for use in performing a metrology operation on the set of test wafers, the metrology operation for at least one of confirming deviation from expected results, determining an extent of the deviation, and characterizing the deviation.

A metrology recipe comprising:

• an instruction for measuring a default number of wafers from a test group of wafers;
• an instruction for performing a default metrology operation on a test wafer from the test group of wafers to generate a set of metrology data;
• and
• an instruction for automatically increasing the default number when the set of metrology data indicates a process excursion,
• wherein the instructions for measuring, performing, and increasing are provided on a computer-readable medium.