Heat sink and memory module using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsChang-Yong Park, Yong-Hyun Kim, Kwang-Ho Chun, Hyun-Jong Oh
Life of this patent
Estimating the term…
Abstract
Provided are a heat sink and a memory module using the heat sink. In one embodiment, the heat sink includes a first and second guide pin respectively disposed in first and second heat spreaders placed around an object to be cooled. The first and second guide pins help prevent misalignment problems from occurring between the first and second heat spreaders, as well, as helping prevent the first and second heat spreaders from contacting each other when the first and second heat spreaders are pressed by pressure applied from the outside.
Claims23
A heat sink comprising:
- a first heat spreader facing and contacting a first component disposed on an upper surface of an object to be cooled and emitting heat from the first component;
- a second heat spreader disposed on a rear surface of the object to be cooled and facing and contacting a second component to emit heat from the second component;
- a first guide pin disposed in a first extension portion near both edges of the first heat spreader, inserted and fixed in an insertion hole corresponding to the first extension portion, and installed in the object to be cooled;
- a second guide pin facing the first guide pin, disposed in a second extension portion near both edges of the second heat spreader, inserted and fixed in the insertion hole corresponding to the second extension portion, and installed in the object to be cooled;
- and
- a coupling unit closely adhering and coupling the first and second heat spreaders to the object to be cooled,
- wherein the first and second guide pins are bending pins that are formed integrally with the first and second heat spreaders.
A memory module comprising:
- a printed circuit board (PCB);
- a plurality of first semiconductor packages mounted on an upper surface of the PCB;
- a plurality of second semiconductor packages mounted on a rear surface of the PCB;
- a first heat spreader facing and contacting the plurality of first semiconductor packages and emitting heat from the first semiconductor packages;
- a second heat spreader contacting the second semiconductor packages and emitting heat from the second semiconductor packages;
- a first guide pin disposed in a first extension portion near both edges of the first heat spreader, inserted and fixed in an insertion hole corresponding to the first extension portion, and installed on the PCB;
- a second guide pin disposed in a second extension portion near both edges of the second heat spreader, facing the first guide pin and inserted and fixed in an insertion hole which corresponds to the second extension portion, and installed on the PCB;
- and
- a coupling unit closely adhering and coupling the first and second heat spreaders with the PCB,
- wherein the first and second guide pins are each bending pins formed integrally with the first and second heat spreaders.
A heat sink comprising:
- a first heat spreader disposed on a first surface of an object to be cooled, the object to be cooled including an insertion hole;
- a second heat spreader disposed on a second surface of the object to be cooled;
- a first spacer pin fixed in the first heat spreader and disposed in the insertion hole of the object to be cooled;
- and
- a second spacer pin fixed in the second heat spreader and disposed in the insertion hole of the object to be cooled, wherein the first and second spacer pins are configured to prevent the first heat spreader and the second heat spreader from contacting circuit structures mounted on the object to be cooled,
- wherein the first and second spacer pins are bending pins integrally formed with the first and second heat spreaders, respectively.
Dependencies are inferred from the claim text.