Heat dissipating device
AssigneesFu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
InventorsYi-Shih Hsieh, Peng Qiao
Life of this patent
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Abstract
A heat dissipating device includes a circuit board (23), an electronic component (24) being arranged on the circuit board, a base (211) being thermally attached to the electronic component, and a plurality of fasteners (22). The circuit board defines a plurality of screw holes (230) therein. The base defines a plurality of through holes (213) corresponding to the screw holes of the circuit board. Each fastener includes a bolt (27) extending through a corresponding through hole of the base and then threadly engaging into a corresponding screw hole of the circuit board, and a coil spring (28) mounted around the bolt. The base forms a plurality of latch hooks (214) near each through hole. A bottom ring (222) of the coil spring is sandwiched between the latch hooks and the base.
Claims12
A heat dissipating device being adapted for dissipating heat of an electronic component comprising:
- a base defines a through hole therein, a latch hook being formed on the base near the through hole;
- and
- a fastener comprising a bolt and a coil spring mounted around the bolt, the through hole being adapted for extension of the bolt when the heat dissipating device is assembled to the electronic component, at least one ring of the coil spring being sandwiched between the latch hook and the base;
- wherein the through hole comprises a large portion having a relatively larger diameter and a small portion having a relatively smaller diameter, a step being formed between the large portion and the small portion, the latch hook extending inwardly from a bottom of the large portion, the at least one ring of the coil spring being arranged between the latch hook and the step.
A heat dissipating device, comprising:
- a circuit board defining a plurality of screw holes therein;
- an electronic component being arranged on the circuit board;
- a base being thermally attached to the electronic component, the base defining a plurality of through holes corresponding to the screw holes of the circuit board;
- and
- a plurality of fasteners, each fastener comprising a bolt extending through a corresponding through hole of the base and then threadly engaging into a corresponding screw hole of the circuit board, and a coil spring mounted around the bolt;
- wherein the base forms a plurality of latch hooks near each through hole, and a bottom ring of each coil spring is sandwiched between the latch hooks and the base;
- and
- wherein each through hole comprises a large portion having a relatively larger diameter and a small portion having a relatively smaller diameter, a step being formed between the large portion and the small portion, the latch hooks extending inwardly from a bottom of the large portion, the bottom ring of each coil spring being arranged between the latch hooks and the step.
A heat dissipating device being adapted for dissipating heat of an electronic component comprising:
- a base defines a through hole therein, a latch hook being formed on the base near the through hole;
- and
- a fastener comprising a bolt and a coil spring mounted around the bolt, the through hole being adapted for extension of the bolt when the heat dissipating device is assembled to the electronic component, at least one ring of the coil spring being sandwiched between the latch hook and the base;
- wherein the latch hook extends upwardly from a top surface of the base and towards the through hole, a receiving space is defined between the latch hook and the top surface of the base, the at least one ring of the coil spring is received in the receiving space.
Dependencies are inferred from the claim text.