Heat dissipation device
AssigneesFu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
InventorsShi-Wen Zhou, Chun-Chi Chen, Guo Chen
Life of this patent
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Abstract
A heat dissipation device includes a spreader, a heat sink comprising a base plate and a plurality of outer fins extending upwardly from a top surface of the base plate, a heat pipe thermally connecting the heat sink and the spreader together, a plurality of fasteners each including a fixture having a head at a top thereof, a spring encircling the fixture and a gasket wired on the fixtures. The fixtures extend through the base plate of the heat sink and the spreader, the gaskets are respectively compressed between the heads and the base plate, edge of the base plate of the heat sink is joined with the housing of the computer, and cooperates with the housing to form a hermetic encapsulation which encloses the heat-generating electronic component.
Claims16
A heat dissipation device for removing heat from a heat-generating electronic component mounted on a printed circuit board enclosed in a computer housing, comprising:
- a spreader adapted for contacting with the heat-generating electronic component;
- a heat sink comprising a base plate and a plurality of outer fins extending upwardly from a top surface of the base plate;
- a heat pipe thermally connecting the heat sink and the spreader together;
- and
- a plurality of fasteners each comprising a fixture having a head at a top thereof, a spring encircling the fixture and a gasket mounted around the fixture between the spring and the head;
- wherein the fixtures extend through the base plate of the heat sink and the spreader and each have a lower end being screwed downwardly into the printed circuit board, the gaskets are respectively compressed between the heads and the base plate, an edge of the base plate of the heat sink is joined with the computer housing, and cooperates with the computer housing to form a hermetic encapsulation which encloses the heat-generating electronic component.
A computer system, comprising:
- a computer enclosure having inner boards extending from inner sides thereof;
- a printed circuit board mounted in the computer enclosure and having an electronic component mounted thereon;
- a heat spreader mounted on the electronic component;
- a heat sink having a base plate parallel to spaced from the heat spreader, wherein the inner boards of the computer enclosure engage with the base plate of the heat sink to form a hermetic encapsulation to prevent dust from entering therein;
- a plurality of fasteners extending through the base plate and the heat spreader to engage with the printed circuit board and each having a shaft, an elastic sleeve mounted around the shaft, and a spring mounted around the shaft and located below the sleeve, the sleeve mounted between a top of the shaft and the base plate, the spring compressed between the heat spreader and the base plate;
- and
- a heat pipe having an evaporating portion embedded in the heat spreader and a condensing portion embedded in the base plate of the heat sink.
Dependencies are inferred from the claim text.