Electronic apparatus cooling structure

An electronic apparatus comprising:

• a circuit board;
• a plurality of circuit elements mounted on a top surface of the circuit board, the plurality of circuit elements including a heat generating element;
• and
• a cooling structure that includes a heat spreader, a plurality of cooling fins integrally formed with the heat spreader, an air inlet, an air outlet, and a fan device for generating cooling air flowing from the air inlet to the air outlet, wherein
• the heat spreader is placed above the circuit board and thermally joined to the heat generating element mounted on the circuit board, wherein
• the plurality of cooling fins extends from a bottom surface of the heat spreader toward the top surface of the circuit board to provide a plurality of air passages between the top surface of the circuit board and the bottom surface of the heat spreader, wherein
• the air inlet and the air outlet communicate with each other through the plurality of air passages, wherein
• a first one of the plurality of cooling fins has a first length measured from the bottom surface of the heat spreader and located above a first one of the plurality of circuit elements to provide a first clearance therebetween, the first one of the plurality of circuit elements having a first height measured from the top surface of the circuit board, wherein
• a second one of the plurality of cooling fins has a second length measured from the bottom surface of the heat spreader and located above a second one of the plurality of circuit elements to provide a second clearance therebetween, the second one of the plurality of circuit elements having a second height measured from the top surface of the circuit board, wherein
• the first length is greater than the second length, and wherein
• the first height is less than the second height.