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US 7,605,907 B2Granted
Method of forming a substrate for use in calibrating a metrology tool, calibration substrate and metrology tool calibration method
AssigneeASML Netherlands B.V.
InventorsHugo Augustinus Joseph Cramer, Antoine Gaston Marie Kiers, Gerardus Maria Johannes Wijnand Janssen
Life of this patent
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Abstract
The present invention provides a method for forming a substrate for use in calibrating a metrology tool in order to compensate for orientation-dependent variations within the metrology tool.
Claims18
A method of forming a substrate suitable for use in calibrating a metrology tool, comprising:
- providing a layer of radiation-sensitive material to a surface of a substrate;
- patterning a first beam of radiation using a patterning device that provides a calibration pattern including a first set of pattern features and a second set of pattern features;
- projecting the patterned first beam of radiation onto the radiation-sensitive material such that radiation patterned by the first set of pattern features of the calibration pattern forms a first calibration mark having a set of elongate pattern features and radiation patterned by the second set of pattern features of the calibration pattern forms a second calibration mark having a set of elongate pattern features;
- rotating the substrate by a predetermined angle relative to the projection system about an axis substantially perpendicular to the surface of the substrate;
- patterning a second beam of radiation using the patterning device and projecting it onto the radiation-sensitive material such that radiation patterned by the first set of pattern features of the calibration pattern forms a third calibration mark having a set of elongate pattern features and radiation patterned by the second set of pattern features of the calibration pattern forms a fourth calibration mark having a set of elongate pattern features;
- wherein the predetermined angle is such that the orientation of the elongate pattern features of the second calibration mark is substantially parallel to the orientation of the elongate pattern features of the third calibration mark.
3 more elements
A method of calibrating a metrology tool, comprising inspecting a plurality of calibration marks on a substrate formed by a method including
- providing a layer of radiation-sensitive material to a surface of the substrate;
- patterning a first beam of radiation using a patterning device that provides a calibration pattern including a first set of pattern features and a second set of pattern features;
- projecting the patterned first beam of radiation onto the radiation-sensitive material such that radiation patterned by the first set of pattern features of the calibration pattern forms a first calibration mark having a set of elongate pattern features and radiation patterned by the second set of pattern features of the calibration pattern forms a second calibration mark having a set of elongate pattern features;
- rotating the substrate by a predetermined angle relative to the projection system about an axis substantially perpendicular to the surface of the substrate;
- patterning a second beam of radiation using the patterning device and projecting it onto the radiation-sensitive material such that radiation patterned by the first set of pattern features of the calibration pattern forms a third calibration mark having a set of elongate pattern features and radiation patterned by the second set of pattern features of the calibration pattern forms a fourth calibration mark having a set of elongate pattern features;
- wherein the predetermined angle is such that the orientation of the elongate pattern features of the second calibration mark is substantially parallel to the orientation of the elongate pattern features of the third calibration mark.
3 more elements
Dependencies are inferred from the claim text.