Process for the singulation of integrated devices in thin semiconductor chips
AssigneeSTMicroelectronics S.r.l.
InventorsAnna Ponza, Riccardo Depetro, Pietro Montanini
Life of this patent
Estimating the term…
Abstract
A process for the fabrication of an integrated device in a semiconductor chip envisages: forming a semiconductor layer partially suspended above a semiconductor substrate and constrained to the substrate by temporary anchorages; dividing the layer into a plurality of portions laterally separated from one another; and removing the temporary anchorages, in order to free the portions.
Claims29
A process comprising:
- making a plurality of buried cavities by steps including forming a semiconductor layer partially suspended above a semiconductor substrate and constrained to said substrate by temporary anchorages;
- dividing said layer into a plurality of portions laterally separated from one another;
- and
- removing said temporary anchorages in order to free said portions.
A process for fabricating an integrated semiconductor device, comprising:
- forming a semiconductor layer above a semiconductor substrate;
- forming temporary anchorages supporting the semiconductor layer on the substrate;
- and
- removing the temporary anchorages by a mechanical action.
A process for the fabrication of integrated devices in a semiconductor chip, comprising:
- making a plurality of buried cavities by steps including forming a semiconductor layer partially suspended above a semiconductor substrate and constrained to the substrate by temporary anchorages between the cavities;
- dividing the layer into a plurality of portions laterally separated from one another;
- and
- removing the temporary anchorages in order to free the portions.
A process for the fabrication of integrated devices in a semiconductor chip, comprising the steps of:
- forming a semiconductor layer partially suspended above a semiconductor substrate and constrained to said substrate by temporary anchorages;
- dividing said layer into a plurality of portions laterally separated from one another;
- and
- removing said temporary anchorages in order to free said portions, wherein said removing comprises breaking said temporary anchorages by a mechanical action.
Dependencies are inferred from the claim text.