Pellicle for lithography
AssigneeShin-Etsu Chemical Co., Ltd.
InventorYoshihiko Nagata
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Abstract
There is disclosed a pellicle for lithography comprising a pellicle film, a pellicle frame to which the pellicle film is adhered, and a sticking layer placed on another end face of the pellicle frame, wherein the pellicle film consists of multi-layer structure of fluorine-doped silica and fluorocarbon resin. Thereby, there is provided a pellicle for lithography which has high transmittance and high light stability against light of short wavelength such as far-ultraviolet light in a range of 200-300 nm and especially vacuum ultraviolet light of 200 nm or less, and is sufficiently practicable.
Claims12
A pellicle for lithography comprising a pellicle film, a pellicle frame to which the pellicle film is adhered, and a sticking layer placed on another end face of the pellicle frame, wherein the pellicle film consists of multi-layer structure of fluorine-doped silica and fluorocarbon resin thereby supplementing the strength of the pellicle film;
- wherein an absorption coefficient of an ultraviolet ray at a wavelength of 157 nm of a layer of the fluorocarbon resin of the pellicle film is 0.06/μm or less;
- and wherein a thickness of a layer of the fluorine-doped silica is 20 μm or less, and a thickness of the layer of the fluorocarbon resin is 0.8 μm or more and 1 μm or less.
Dependencies are inferred from the claim text.