Integrated liquid cooled heat sink for electronic components

A fluid heat exchanger unit for cooling an electronic device and comprising;

• a cooling housing having a liquid coolant inlet for receiving liquid coolant from the system and a liquid coolant outlet and an upper portion and a lower portion with said liquid coolant inlet and said liquid coolant outlet being in said upper portion,
• a partition dividing said cooling housing into said upper portion, with said upper portion having an upper wall, and said lower portion for establishing a direction of liquid coolant flow in a coolant passage from said liquid coolant inlet to said liquid coolant outlet in said upper portion between said partition and said upper wall,
• a refrigerant disposed in said lower portion of said cooling housing for liquid-to-vapor transformation,
• said cooling housing being hermetically sealed about said partition to separate said refrigerant in said lower portion from the liquid coolant in said upper portion, and
• a heat rejecter disposed on and above said upper wall of said cooling housing with a rejecter inlet adjacent and in fluid communication with said liquid coolant outlet and a rejecter outlet adjacent said liquid coolant inlet for returning liquid coolant to the system,
• wherein said upper wall of said cooling housing includes a filler material for providing a common wall with a flat surface for integration of said heat rejecter,
• wherein said heat rejecter includes a plurality of first air fins disposed along said upper wall between said rejecter inlet and said rejecter outlet, and
• wherein said heat rejecter includes a first header extending from said rejecter inlet in a direction transverse to said upper wall and a second header extending from said rejecter outlet in a direction transverse to said upper wall and including at least one first tube extending between and in fluid communication with said first header and said second header with said first air fins disposed between said upper wall and said first tube.

A fluid heat exchanger unit for cooling an electronic device and comprising;

• a cooling housing having a liquid coolant inlet for receiving liquid coolant from the system and a liquid coolant outlet and an upper portion and a lower portion with said liquid coolant inlet and said liquid coolant outlet being in said upper portion,
• a partition dividing said cooling housing into said upper portion, with said upper portion having an upper wall, and said lower portion for establishing a direction of liquid coolant flow in a coolant passage from said liquid coolant inlet to said liquid coolant outlet in said upper portion between said partition and said upper wall,
• a refrigerant disposed in said lower portion of said cooling housing for liquid-to-vapor transformation,
• said cooling housing being hermetically sealed about said partition to separate said refrigerant in said lower portion from the liquid coolant in said upper portion, and
• a heat rejecter disposed on and above said upper wall of said cooling housing with a rejecter inlet adjacent and in fluid communication with said liquid coolant outlet and a rejecter outlet adjacent said liquid coolant inlet for returning liquid coolant to the system;
• wherein said heat rejecter includes a plurality of first air fins disposed along said upper wall between said rejecter inlet and said rejecter outlet;
• wherein said heat rejecter includes a first header extending from said rejecter inlet in a direction transverse to said upper wall and a second header extending from said rejecter outlet in a direction transverse to said upper wall and including at least one first tube extending between and in fluid communication with said first header and said second header with said first air fins disposed between said upper wall and said first tube;
• and
• wherein said rejecter includes a tunnel-shaped casing extending from said liquid coolant inlet upwardlly with said second header and across said unit and downwardly with said first header to said liquid coolant outlet.

A fluid heat exchanger unit for cooling an electronic device and comprising;

• a cooling housing having a liquid coolant inlet for receiving liquid coolant from the system and a liquid coolant outlet and an upper portion and a lower portion with said liquid coolant inlet and said liquid coolant outlet being in said upper portion,
• a partition dividing said cooling housing into said upper portion, with said upper portion having an upper wall, and said lower portion for establishing a direction of liquid coolant flow in a coolant passage from said liquid coolant inlet to said liquid coolant outlet in said upper portion between said partition and said upper wall,
• a refrigerant disposed in said lower portion of said cooling housing for liquid-to-vapor transformation,
• said cooling housing being hermetically sealed about said partition to separate said refrigerant in said lower portion from the liquid coolant in said upper portion, and
• a heat rejecter disposed on and above said upper wall of said cooling housing with a rejecter inlet adjacent and in fluid communication with said liquid coolant outlet and a rejecter outlet adjacent said liquid coolant inlet for returning liquid coolant to the system;
• wherein said heat rejecter includes a plurality of first air fins disposed along said upper wall between said rejecter inlet and said rejecter outlet;
• wherein said heat rejecter includes a first header extending from said rejecter inlet in a direction transverse to said upper wall and a second header extending from said rejecter outlet in a direction transverse to said upper wall and including at least one first tube extending between and in fluid communication with said first header and said second header with said first air fins disposed between said upper wall and said first tube;
• and
• wherein said liquid coolant inlet to said cooling housing feeds an inlet gallery and is defined by a tubular member and said rejecter outlet includes a tubular outlet parallel to said tubular member.