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US 7,598,729 B2Granted
Semiconductor chip flipping assembly and apparatus for bonding semiconductor chip using the same
AssigneeSIGO Co., Ltd.
InventorSung Chul Kim
Life of this patent
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Abstract
A semiconductor chip flipping assembly and an apparatus for bonding a semiconductor chip using the same are disclosed. In accordance with the semiconductor chip flipping assembly and the apparatus for bonding a semiconductor chip using the same, a front surface of a wafer is mounted in a wafer holder to face downward. Each of dies of the wafer is then pushed downward to a tray disposed therebelow, thereby eliminating a need for a separate flipping process of the semiconductor chip and two or more robot arms.
Claims17
A semiconductor chip bonding apparatus comprising:
- an object feeding module for providing an object to be bonded;
- a semiconductor chip flipping assembly for sequentially disposing each of a plurality of semiconductor chips of a wafer on a tray disposed therebelow;
- and
- a press module for applying a pressure to each of the plurality of semiconductor chips disposed on the object so as to electrically bond each of the plurality of semiconductor chips to the object;
- wherein the semiconductor chip flipping assembly comprises:
- a wafer holder for mounting the wafer in a manner that a front surface of the wafer faces downward;
- a pusher for pushing each of the plurality of semiconductor chips of the mounted wafer downward to be disposed on the tray;
- a tray conveying module for moving the tray;
- and
- a pickup module for sequentially picking up each of the plurality of semiconductor chips disposed in the tray and disposing the picked up semiconductor chip on the object to be bonded provided by the object feeding module.
7 more elements
A semiconductor chip flipping assembly comprising:
- a wafer holder for holding a wafer in a manner that a front surface of the wafer faces downward;
- a pusher for sequentially pushing each of plurality of semiconductor chips of the mounted wafer downward;
- a tray disposed under the wafer, the tray including a semiconductor chip guide for disposing the plurality of semiconductor chips pushed by the pusher therein;
- and
- a pickup module for sequentially picking up each of the plurality of semiconductor chips disposed in the tray and disposing the picked up semiconductor chip on an object to be bonded.
2 more elements
Dependencies are inferred from the claim text.