Controlling warping in integrated circuit devices
AssigneeAgere Systems Inc.
InventorsJohn W. Osenbach, Thomas H. Shilling, Weidong Xie
Life of this patent
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Abstract
Techniques for integrated circuit device fabrication are provided. In one aspect, an integrated circuit device comprises a base, at least one die attached to the base, and a counterbalancing layer on at least a portion of at least one side of the base adapted to compensate for at least a portion of a thermal expansion difference existing between the base and the die. In another aspect, warping of an integrated circuit device comprising at least one die attached to a base is controlled by applying a counterbalancing layer to at least a portion of at least one side of the base adapted to compensate for at least a portion of a thermal expansion difference existing between the base and the die.
Claims2
An integrated circuit device comprising:
- a base comprising one or more non-metals;
- at least one die attached to the base;
- and
- a counterbalancing layer on at least a portion of at least one side of the base adapted to compensate for at least a portion of a thermal expansion difference existing between the base and the die, wherein said counterbalancing layer comprises at least one metal.
An integrated circuit device comprising:
- a base comprising one or more of silicon carbide, aluminum nitride and chemical vapor deposited diamond;
- at least one die attached to the base;
- and
- a counterbalancing layer on at least a portion of at least one side of the base adapted to compensate for at least a portion of a thermal expansion difference existing between the base and the die, wherein said counterbalancing layer comprises at least one metal.
Dependencies are inferred from the claim text.