Semiconductor device
AssigneeOki Semiconductor Co., Ltd.
InventorKatsuhiko Sasahara
Life of this patent
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Abstract
A semiconductor device comprises one or two semiconductor chips, each including an input circuit having a wiring (3) for connecting an input pad (2) to an inner circuit, a first electrostatic protection element (1) electrically connected to the wiring, a second electrostatic protection element (1), and a fuse (4) provided between the wiring (3) and second electrostatic protection element (1). When the semiconductor device has one semiconductor chip, the wiring (3) and second electrostatic protection element (1) are connected to each other through the fuse (4), and when the semiconductor device has said two semiconductor chips, the fuse (4) is disconnected so that the second electrostatic protection element (1) is electrically disconnected from the wiring (3).
Claims13
A semiconductor device, comprising:
- a semiconductor chip including an inner circuit, an input pad, and a wiring that connects the input pad to the inner circuit;
- a plurality of electrostatic protection elements connected to the wiring between the input pad and the inner circuit, each electrostatic protection element including a pair of transistors;
- and
- a fuse disposed between the wiring and at least one of the electrostatic protection elements so that the fuse is between the at least one electrostatic protection element and the inner circuit, the fuse being selectively disconnectable so as to selectively disconnect the at least one electrostatic protection element from wiring when more than one semiconductor chip is mounted in a package with the semiconductor chip and commonly connected to the input pad.
A device, comprising:
- a pair of semiconductor chips, each semiconductor chip including an inner circuit, an input pad, and a wiring that connects the input pad to the inner circuit;
- a first electrostatic protection element connected to the wiring at a first location between the input pad and the inner circuit;
- a second electrostatic protection element selectively connected to the wiring at a second location, between the input pad and the inner circuit, downstream of the first location and the first electrostatic protection element;
- and
- a pair of fuses respectively disposed between the wiring and different portions of the second electrostatic protection element so that the fuses are between the second electrostatic protection element and the inner circuit, the fuses being selectively disconnectable so as to selectively disconnect the second electrostatic protection element from the wiring,
- wherein the input pads of the respective semiconductor chips are commonly connected to a common terminal.
Dependencies are inferred from the claim text.