US 7,598,507 B2 · Adjustable lithography blocking device and method

Abstract

The present invention provides, in one embodiment, a method (100) of manufacturing a semiconductor device. A conventionally formed reticle is positioned over a resist located on a substrate (110). A radiation path through the reticle and a window assembly located between a radiation source and resist (120), is considered. It is determined whether or not the radiation would expose a predefined blocking area of the resist within the exposure zone (130). If the radiation would expose a blocking area, then the window assembly is configured to prevent radiation from exposing the blocking area in the exposure zone (140). Other embodiments include a window assembly (300) and system (400) to facilitate manufacturing of the semiconductor device according to the method (100).

Claims12

Dependent claims

A method of manufacturing a semiconductor device, comprising:

providing a resist layer over a substrate;
defining a blocking region on said substrate where said overlying resist layer will not be exposed;
providing a reticle having device patterns formed therein wherein said device patterns define an exposure zone;
providing a radiation source and a window assembly wherein said window assembly is located between said radiation source and said resist;
positioning said reticle between said radiation source and said resist wherein said exposure zone of said reticle is at least partially over said blocking region;
and
adjusting an exposure width of said window assembly to prevent radiation from said radiation source from exposing said blocking region wherein adjusting includes moving one or more shutters of said window assembly as a function of said window assembly's location above said substrate.

4 more elements

Dependencies are inferred from the claim text.

Adjustable lithography blocking device and method

Life of this patent

Adjustable lithography blocking device and method

Life of this patent

Abstract

Claims12