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US 7,598,126 B2Granted
Use of nanoscale particles for creating scratch-resistant protective layers on semiconductor chips
AssigneeInfineon Technologies AG
InventorHorst Theuss
Life of this patent
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Abstract
Inorganic-based nanoparticles, such as nanoparticles based on silicon dioxide, are used in order to produce protective layers for semiconductor chips having scratch-resistant properties. The nanoparticles are preferably processed to form a sol, which is applied onto the semiconductor chips to be coated and subsequently converted by sintering into the protective layer.
Claims14
A method for coating semiconductor chips with nanoscale particles, comprising:
- producing nanoparticles comprising at least one of silicon dioxide particles, metal particles and ceramic oxide particles;
- preparing a sol of the nanoparticles;
- coating semiconductor chips with the sol;
- forming a gel layer or green layer from the sol by at least one of aging and drying the semiconductor chips coated with the sol;
- and
- forming a protective layer on the semiconductor chips by sintering the semiconductor chips coated with the gel layer or green layer.
3 more elements
A method for coating semiconductor chips with nanoscale particles, comprising:
- hydrolyzing at least one of silanes and alkoxides to form a hydrolyzed material;
- preparing a sol with the hydrolyzed material;
- coating semiconductor chips with the sol;
- forming a gel layer or green layer from the sol by at least one of aging and drying the semiconductor chips coated with the sol;
- and
- forming a protective layer on the semiconductor chips by sintering the semiconductor chips coated with the gel layer or green layer.
3 more elements
Dependencies are inferred from the claim text.