Method for holding semiconductor wafer

A method for holding a semiconductor wafer by applying the semiconductor wafer on a ring frame through a adhesive tape,

• the method comprising:
• applying a protective tape on a surface of the semiconductor wafer having a pattern formation process performed thereto and subsequently cutting the protective tape along with a contour of the semiconductor wafer;
• back grinding a back side of the semiconductor wafer having the protective tape applied thereto, simultaneously leaving annularly an outer peripheral part un-ground;
• separating the protective tape from a surface of the semiconductor wafer having an annular projected part formed by the back grinding in the outer peripheral part of the back side;
• applying a holding tape over the surface of the semiconductor wafer from which the protective tape having been separated and a surface of the ring frame having the semiconductor wafer disposed in a center thereof,
• removing the annular projected part of the semiconductor wafer having been applied and held on the holding tape;
• applying an adhesive tape over the back side of the semiconductor wafer having been made flat by removal of the annular projected part and a back side of the ring frame;
• and
• separating the holding tape having been applied over the surface of the ring frame and the surface of the semiconductor wafer.