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US 7,598,119 B2Granted
System and method for inhibiting and containing resin bleed-out from adhesive materials used in assembly of semiconductor devices
AssigneeTexas Instruments Incorporated
InventorsSergio V. Martinez, Boon Hor Lee, Karen Lynne Robinson
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Abstract
System and method for preventing resin-based adhesive from contacting a substrate to minimize resin bleed-out and contamination. A preferred embodiment comprises a semiconductor device having a die mounted on a substrate, first and second gold surfaces formed on the substrate, a trench formed between the first and second gold surfaces, resin-based adhesive applied to the first gold surface, and a heat sink bonded to the resin-based adhesive.
Claims7
A method for assembling semiconductor devices comprising:
- applying a first gold surface to a substrate;
- applying lid adhesive to the first gold surface;
- and
- applying a second gold surface to the substrate, wherein the second gold surface is separated from the first gold surface by a trench.
1 more element
Dependencies are inferred from the claim text.