Impingement cooled heat sink with low pressure drop

A heat exchanger for cooling an electronic device comprising;

• a housing having a center and a top and a bottom for engaging said electronic device,
• a plurality of fins extending upwardly from said bottom to upper extremities and extending from and spaced from center,
• a nozzle plate in said housing comprising an upper surface and a lower surface and extending across said center and above said fins and below said top to define a fin chamber below and a fluid chamber above,
• an inlet into said housing at said center for supplying the cooling fluid to said fluid chamber and said nozzle plate,
• a primary nozzle for delivering the cooling fluid from said inlet and through said nozzle plate to said fin chamber for flow from said center between said fins,
• at least one outlet disposed outwardly of said fins for receiving the cooling fluid from said fins, and
• a plurality of secondary nozzles in said nozzle plate and disposed outwardly of said primary nozzle from said center for directing the cooling fluid into said fin chamber outwardly of said primary nozzle from said center;
• wherein said center includes a center axis extending perpendicularly to said upper surface and said lower surface of said nozzle plate;
• wherein said primary nozzle is elongated and extends through said center axis of said nozzle plate;
• and
• wherein said primary nozzle includes converging side walls and end walls extending from said inlet and through said nozzle plate and defines a secondary slot in each of said side walls and positioned below said housing and above said nozzle plate for delivering the cooling fluid into said fluid chamber.