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US 7,583,492 B2Granted
Method of determining the correct average bias compensation voltage during a plasma process
AssigneeLam Research Corporation
InventorArthur M. Howald
Life of this patent
Estimating the term…
Abstract
A method for removing a substrate that is attached to a bipolar electrostatic chuck (ESC) by application of a bipolar ESC voltage is provided which includes discontinuing the bipolar ESC voltage after processing a current substrate, and determining a monopolar component error of the processing. The method also includes correcting the monopolar component error for a subsequent substrate.
Claims17
A method for dechucking a subsequent substrate from a bipolar electrostatic chuck (ESC), comprising:
- applying a bipolar ESC clamping voltage and a bias compensation voltage to the bipolar electrostatic chuck (ESC) during processing of a current substrate;
- determining an error of a value of the bias compensation voltage for the current substrate, wherein the error of the value of the bias compensation voltage for the current substrate is determined during the dechucking of the current substrate from the bipolar electrostatic chuck (ESC);
- and
- correcting a value of the bias compensation voltage for the subsequent substrate based on the error of the value of the bias compensation voltage for the current substrate.
1 more element
A method for dechucking a current substrate from a bipolar electrostatic chuck (ESC), comprising:
- applying a bipolar ESC clamping voltage and the bias compensation voltage to the bipolar electrostatic chuck (ESC) during processing of the current substrate, wherein a value of the bias compensation voltage of the current substrate is estimated;
- determining an error of a value of the bias compensation voltage for the current substrate;
- and
- adding an offset voltage to a reverse polarity voltage for the current substrate based on the error of the value of the bias compensation voltage for the current substrate.
1 more element
Dependencies are inferred from the claim text.