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US 7,582,965 B2Granted
Electronic device and method for bonding an electronic device
AssigneeConti Temic microelectronic GmbH
InventorsHerbert Handl, Alexander Wenk, Matthias Wieczorek
Life of this patent
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Abstract
An electronic device (1) has a base plate (2) and an electronics housing (3) connected thereto, with a bonding contact terminal (5). The latter is supported relative to the base plate (2) via a supporting body (6) in such a manner that the supporting body (6) exerts a pre-stressing force onto the bonding contact terminal (5). Due to this support of the bonding contact terminal (5), its position is well defined during the bonding procedure. A secure bond is the result.
Claims17
An electronic device
- with a base plate,
- with an electronics housing which is connected to the base plate, with at least one bond contact terminal,
- characterized in that the bond contact terminal has a bond contact area adapted to establish an electrical bond connection, and the bond contact terminal is supported on the base plate by a supporting body in such a manner that the supporting body exerts a pretension force onto the bond contact terminal, and the supporting body is arranged and positioned so that the bond contact area of the bond contact terminal is located in an area of the supporting body projecting in a direction in which the supporting body exerts the pretension force onto the bond contact terminal.
An electronic device comprising:
- a base plate;
- an electronics housing connected to said base plate;
- an electrical bonding contact terminal that protrudes from said housing, wherein said bonding contact terminal has a free terminal end that projects away from said housing and that includes a bond contact area adapted to establish an electrical bond connection, and wherein said bonding contact terminal further has a root end adjoining said housing opposite said free terminal end;
- and
- a support body that is interposed between said free terminal end including said bond contact area of said bonding contact terminal and said base plate, and that supports said free terminal end of said bonding contact terminal relative to said base plate, and that deflects said free terminal end of said bonding contact terminal away from said base plate and thereby exerts a pre-stressing force onto said bonding contact terminal because a projection height of said support body from said base plate is greater than a nominal distance between said free terminal end of said bonding contact terminal and said base plate in a pre-assembly condition without said support body yet interposed therebetween;
- and
- wherein said support body is arranged and positioned so that said bond contact area of said bonding contact terminal is located in an area of said support body projected in a direction in which said support body exerts said pre-stressing force onto said bonding contact terminal.
4 more elements
Dependencies are inferred from the claim text.