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US 7,582,962 B1Granted
Heat dissipation device
AssigneeRockwell Collins, Inc.
InventorJeanne S. Pavio
Life of this patent
Estimating the term…
Abstract
A heat dissipation device comprises a multilayer substrate, a channel formed in the multilayer substrate, and tubes disposed within the channel, the tubes suitable for removing heat from a heat generating device located adjacent to the multilayer substrate.
Claims19
A heat dissipation device comprising:
- a multilayer substrate;
- a channel formed in the multilayer substrate;
- tubes disposed within the channel, the tubes suitable for removing heat from a heat generating device located adjacent to the multilayer substrate;
- and
- a diamond filled organic underfill, the diamond filled organic underfill disposed within an area adjacent to a second side of the heat generating device opposite a first side adjacent to the multilayer substrate, wherein the diamond filled organic underfill is suitable for removing heat from the heat generating device.
2 more elements
A heat dissipation device comprising:
- a multilayer substrate;
- a channel formed in the multilayer substrate;
- tubes disposed within the channel;
- and
- a diamond filled organic underfill,
- wherein the multilayer substrate is located adjacent to a semiconductor and the diamond filled organic underfill is disposed within an area adjacent to a second side of the semiconductor opposite a first side adjacent to the multilayer substrate,
- wherein the tubes and the diamond filled organic underfill are suitable for removing heat from the semiconductor.
4 more elements
Dependencies are inferred from the claim text.