Method for redirecting void diffusion away from vias in an integrated circuit design
AssigneeLSI Logic Corporation
InventorsDerryl D. J. Allman, Hemanshu D. Bhatt, Charles E. May, Peter Austin Burke, Byung-Sung Kwak, Sey-Shing Sun, David T. Price, David Pritchard
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Abstract
A method for redirecting void diffusion away from vias in an integrated circuit design includes steps of forming an electrical conductor in a first electrically conductive layer of an integrated circuit design, forming a via between a distal end of the electrical conductor and a second electrically conductive layer of the integrated circuit design, and reducing tensile stress in the electrical conductor to divert void diffusion away from the via.
Claims11
A method for redirecting void diffusion away from vias in an integrated circuit design, the method comprising steps of:
- (a) forming an electrical conductor in a first electrically conductive layer of an integrated circuit design;
- (b) forming a via between a distal end of the electrical conductor and a second electrically conductive layer of the integrated circuit design;
- and
- (c) reducing tensile stress in the electrical conductor to divert void diffusion away from the via.
Dependencies are inferred from the claim text.