Method of bonding flying leads
AssigneeFujitsu Limited
InventorsTakashi Kubota, Kenji Kobae, Kimio Nakamura
Life of this patent
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Abstract
The method of bonding flying leads is capable of efficiently supersonic-bonding the flying leads to pads of a board and improving bonding reliability therebetween. The method comprises the steps of: mechanically processing the board so as to form projections, which act as margins for deformation, in boding faces of the pads, on each of which the flying lead will be bonded, positioning the flying leads to correspond to the pads; and applying supersonic vibrations to a bonding tool so as to deform and crush the projections, whereby the flying leads are respectively bonded to the pads.
Claims9
A method of bonding flat-shaped flying leads to pads of a board, comprising the steps of:
- mechanically processing the board so as to form projections, which act as margins for deformation, in bonding faces of the pads, on each of which a flying lead will be bonded,
- positioning the flying leads to correspond to the pads;
- and
- applying supersonic vibrations to a bonding tool, the bonding tool having a width that is larger than an interval between the projections, so as to deform and crush the projections, whereby the flying leads are respectively bonded to the pads;
- wherein each of the projections is formed by pressing a press tool onto the pads of a board so as to form a cavity in the bonding face, so that the projection is formed along an edge of the cavity.
A method of bonding flat-shaped flying leads to pads of a board, comprising the steps of:
- mechanically processing the board so as to form projections, which act as margins for deformation, in bonding faces of the pads, on each of which a flying lead will be bonded,
- positioning the flying leads to correspond to the pads;
- and
- applying supersonic vibrations to a bonding tool, the bonding tool having a width that is larger than an interval between the projections, so as to deform and crush the projections, whereby the flying leads are respectively bonded to the pads;
- wherein each of the projections is formed by pressing a press tool onto a reverse face of the board toward the pad, so that the projection is formed in the bonding face.
Dependencies are inferred from the claim text.