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US 7,582,221 B2Granted
Wafer manufacturing method, polishing apparatus, and wafer
AssigneeShin-Etsu Handotai Co., Ltd.
InventorsShigeyoshi Netsu, Hisashi Masumura
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Abstract
The present invention provides a wafer manufacturing method and a wafer polishing apparatus which enable control of sags in a periphery of a wafer and improvement of nanotopology values thereof that is strongly required recently, and a wafer. In a polishing process for making a mirror surface of the wafer, a back surface of the wafer is polished to produce a reference plane thereof.
Claims9
A wafer manufacturing method comprising the steps of:
- performing primary polishing to at least the front side of a wafer,
- after performing the primary polishing step, performing reference plane producing-mirror polishing to the back side of the wafer to produce a mirror surface as a reference plane on the back side of the wafer, and
- after performing the reference plane producing-mirror polishing step, performing secondary polishing to at least the front side of the wafer,
- wherein said reference plane producing-mirror polishing of said back side removes an amount of stock of the wafer of at least 3 μm and no greater than 10 μm.
1 more element
Dependencies are inferred from the claim text.