Solution treatment apparatus and solution treatment method
AssigneeTokyo Electron Limited
InventorsNobuaki Matsuoka, Tsunenaga Nakashima, Shinichi Hayashi, Akira Oozono
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AssigneeTokyo Electron Limited
InventorsNobuaki Matsuoka, Tsunenaga Nakashima, Shinichi Hayashi, Akira Oozono
Estimating the term…
In the present invention, a plurality of exhaust paths connected to a plurality of cup bodies surrounding substrate holding portions respectively are joined together for common use, and the openings of exhaust rate adjustment sections provided on the exhaust paths are adjusted with reference to data in which combinations of the numbers of rotations of the substrate holding portions are associated with combinations of set exhaust rates of the exhaust paths when solution treatment is performed by rotating the substrate by the substrate holding portion. According to the present invention, the cup body can be exhausted at an intended exhaust rate at all times independently of the state where the substrate in which cup body is subjected to which process.
A solution treatment apparatus in which a substrate holding portion is rotated with a treatment solution being supplied from a treatment solution nozzle onto a substrate held on the substrate holding portion to spread the treatment solution on the substrate, said apparatus comprising:
A solution treatment apparatus in which a substrate holding portion is rotated with a treatment solution being supplied from a treatment solution nozzle onto a substrate held on the substrate holding portion to spread the treatment solution on the substrate, said apparatus comprising:
Dependencies are inferred from the claim text.