Boost spring holder for securing a power device to a heatsink
AssigneeCummins Power Generation IP, Inc.
InventorAllen Carney
Life of this patent
Estimating the term…
Abstract
A system and method of dissipating heat form electronic components in an electronic device is disclosed. The apparatus includes a retaining device having a cavity extending upwardly a predetermined distance from a lower surface of the casing. A spring is seated within the cavity such that a lower portion of the spring protrudes outwardly a predetermined distance from the lower surface of the casing. A heatsink is positioned below a heat generating component such that the spring of the retaining device forces the heat generating component against the heatsink.
Claims20
An apparatus, comprising:
- electronic circuitry including a component structured to generate heat during operation;
- a heatsink structured to dissipate at least a portion of the heat generated by the component;
- a spring including a first end portion opposite a second end portion;
- and
- a retaining device including a cavity receiving the first end portion of the spring, the retaining device being positioned in an overlapping relationship with the component and fixed in relation to the heatsink to bias the spring and position the second end portion of the spring to clamp the component in a thermally coupled relationship with the heatsink, wherein the cavity extends from an opening to an engagement seat opposite the opening, and the engagement seat is shaped and sized to engage the first end portion of the spring in a press-fit coupled relationship.
A method, comprising:
- positioning electronic circuitry including a component structured to generate heat during operation on a portion of a heatsink structured to dissipate at least a portion of the heat generated by the component;
- providing a spring comprising a first end portion opposite a second end portion;
- providing a retaining device comprising a cavity that extends from an opening to an engagement seat opposite the opening;
- connecting the first end portion of the spring in the engagement seat of the retaining device with the second end portion protruding from the opening in an uncompressed state;
- and
- after the connecting of the first end portion of the spring, positioning the retaining device in an overlapping relationship with the component and in fixed relation to the heatsink to bias the spring to clamp the component in a thermally coupled relationship with the heatsink.
An apparatus, comprising:
- electronic circuitry including a component structured to generate heat during operation;
- a heatsink structured to dissipate at least a portion of the heat generated by the component;
- a coil spring including a first end portion;
- and
- a retaining device including a cavity receiving the first end portion of the spring, fixed in relation to the heatsink, to hold the spring between the retaining device and the component in a compressed state to exert a force to maintain thermal coupling between the component and the heatsink, and wherein the cavity extends from an opening to an engagement seat opposite the opening, and the engagement seat is shaped and sized to engage the first end portion of the spring in a fixed relationship.
Dependencies are inferred from the claim text.