Detachable electrostatic chuck for supporting a substrate in a process chamber

An electrostatic chuck for attachment to a pedestal in a substrate processing chamber capable of processing a substrate in an energized process gas, the electrostatic chuck comprising:

• (a) at least one electrode capable of being charged to energize a process gas;
• (b) a dielectric covering the electrode;
• (c) a frontside surface to receive a substrate;
• (d) an annular flange;
• and
• (e) a backside surface comprising a D-shaped mesa surrounded by an annular trough, the D-shaped mesa comprising asymmetrically offset orifices that include at least one orifice that is offset from another orifice by an angle of from about 115 to about 135°.

A substrate support for a substrate processing chamber capable of processing a substrate in an energized process gas, the support comprising:

• (a) an electrostatic puck comprising a dielectric covering at least one electrode capable of being charged to energize a process gas and having a frontside surface to receive a substrate;
• (b) a base plate attached to the electrostatic puck, the base plate comprising (i) a composite of porous ceramic and infiltrated metal, (ii) an annular flange extending beyond the periphery of the dielectric, and (iii) a backside surface comprising a central protrusion with a circular contour portion having a radial center, the central protrusion having asymmetrically offset orifices for receiving electrode terminal posts and a gas tube, the orifices being offset from one another by asymmetric angles which are measured from the radial center of the circular contour portion;
• and
• (c) a pedestal having a peripheral ledge capable of being attached to the annular flange of the base plate, and a cavity shaped to correspond to, and receive, the central protrusion of the base plate.

A substrate support for a substrate processing chamber capable of processing a substrate in an energized process gas, the support comprising:

• (a) an electrostatic chuck comprising:
• (i) an electrostatic puck comprising a dielectric covering at least one electrode capable of being charged to energize a process gas and having a frontside surface to receive a substrate;
• and
• (ii) a base plate below the electrostatic puck, the base plate having an annular flange, and a backside surface comprising a central protrusion with a circular contour portion having a radial center, the central protrusion having asymmetrically offset orifices for receiving electrode terminal posts and a gas tube, the orifices being offset from one another by asymmetric angles which are measured from the radial center of the circular contour portion;
• (b) a pedestal having a peripheral ledge to attach to the annular flange of the base plate of the electrostatic chuck;
• and
• (c) a spring loaded heat transfer plate on the pedestal to contact the electrostatic chuck, the heat transfer plate comprising (i) a fluid channel, (ii) a first plate comprising a first material, and (iii) a second plate comprising a second material that is a different material from the first material, the second plate positioned below the first plate.

An electrostatic chuck for attachment to a pedestal in a substrate processing chamber capable of processing a substrate in an energized process gas, the pedestal having a groove, the electrostatic chuck comprising:

• (a) at least one electrode capable of being charged to energize the process gas;
• (b) a dielectric covering the electrode;
• (c) a frontside surface to receive a substrate;
• (d) an annular flange;
• (e) a backside surface comprising a central protrusion having orifices for receiving electrode terminal posts and a gas coupler;
• (f) a first polished ring encircling the gas coupler;
• and
• (g) a second polished ring that is radially outward from the first polished ring, wherein the first and second polished rings receive an O-ring which sits in the groove in the pedestal in the chamber.