US 7,479,356 B2Granted

Aligning method

AssigneeFujitsu Limited

InventorTeruyoshi Yao

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Abstract

A method, wherein a plurality of first patterns are formed in an exposure region, and second patterns are formed by plural shots, with positions of alignment marks measured for said plurality of first patterns to give first positional information; relative positions of said plurality of first patterns to a first coordinate system are measured, to thereby compute first disalignments relative to the first coordinate system; second positional information is computed by subtracting the first disalignments from the first positional information; relative positions of said plural basic regions with respect to a second coordinate system are measured, to thereby compute second disalignments of the first pattern relative to the second coordinate system; third positional information is computed by subtracting the first and second disalignments from the first positional information; third disalignments of the first pattern with respect to a third coordinate system are computed; and positioning with respect to the first pattern is made when the second pattern is exposed, based on the first to third disalignments.

Claims10

Dependent claims

An aligning method for forming, over a substrate over which a plurality of first patterns each having plural basic regions formed in an exposure region of one shot, second patterns by plural shots of exposure corresponding to the respective basic regions, comprising:

measuring, for said plurality of first patterns formed over the substrate, positions of alignment marks to thereby give first positional information;
giving relative positions of said plurality of first patterns with respect to a first coordinate system with the center of the substrate as the origin, based on the first positional information measured, to thereby compute first disalignments of said plurality of first patterns with respect to the first coordinate system;
computing second positional information given by subtracting the first disalignments from the first positional information;
giving relative positions of said plural basic regions with respect to a second coordinate system with the shot center of the first pattern as the origin, based on the second positional information, to thereby compute second disalignments of the first pattern with respect to the second coordinate system;
computing third positional information given by subtracting the first disalignments and the second disalignments from the first positional information;
computing third disalignments of the first pattern with respect to a third coordinate system with the shot center of the second pattern as the origin, based on the third positional information;
and
making positioning with respect to the first pattern when the second pattern is exposed, based on the first to the third disalignments.

5 more elements

An aligning method comprising:

measuring disalignment inspection marks for one substrate with a plurality of first patterns each having a plurality of basic regions formed in an exposure region of one shot formed on and second patterns formed on by plural shots of exposure corresponding to said respective basic region, to thereby measure disalignments of the second pattern with respect to the first pattern as first disalignment information;
giving relative positions of said plural second patterns with respect to a first coordinate system with the center of the substrate as the origin to thereby compute first disalignments of said plurality of second patterns with respect to the first coordinate system;
computing second disalignment information given by subtracting the first disalignments from the first disalignment information;
giving, based on the second disalignment information, relative positions of said plurality of second patterns with respect to a second coordinate system with the shot center of the first pattern as the origin to thereby compute second disalignments of the second pattern with respect to the second coordinate system;
computing third disalignment information given by subtracting the first disalignments and the second disalignments from the first disalignment information;
computing, based on the third disalignment information, third disalignments of the second pattern with respect to a third coordinate system with the shot center of the second pattern as the origin;
and
making positioning with respect to the first pattern when the second pattern is exposed with respect to the first pattern formed on another substrate, based on the first to the third disalignments.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application: 12/019,190Filed 24 Jan 2008 · continuation
Priority: 26 Jul 2005
Published: US 2008/0118851 A122 May 2008
Granted: 20 Jan 2009
Term ends: Not estimatedThe source records don’t support an estimate.

Classification3 codes

G03F 9/7003
For microlithography: alignment type or strategy, e.g. leveling, global alignment
G03F 7/70633
Monitoring the printed patterns: overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the…
G03F
Photomechanical production of textured or patterned surfaces