Coating treatment apparatus and coating treatment method
AssigneeTokyo Electron Limited
InventorsYoshiteru Fukuda, Tomohiro Iseki, Takayuki Ishii
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AssigneeTokyo Electron Limited
InventorsYoshiteru Fukuda, Tomohiro Iseki, Takayuki Ishii
Estimating the term…
In the present invention, a plurality of solvent supply nozzles for solvents having different solubility parameters are provided in a coating treatment apparatus. For a solvent supply nozzle for use at the time of edge rinse, a solvent supply nozzle is selected that discharges a removal solvent having a solubility parameter different by a set value or more from that of a coating solvent contained in a coating solution. During coating treatment, the coating solution is discharged from a coating solution supply nozzle onto the central portion of a rotated substrate to form a solution film having a predetermined film thickness. Immediately after the formation, edge rinse is started with the coating solution on the substrate not dry yet, in which the removal solvent is supplied to the peripheral portion of the substrate from the selected solvent supply nozzle. In this event, the supplied removal solvent repels the coating solution on the substrate, so that only the coating solution on the peripheral portion is appropriately removed. According to the present invention, a series of coating treatments including the edge rinse can be carried out in a shorter time.
A coating treatment apparatus for applying a coating solution to a front surface of a substrate, comprising:
Dependencies are inferred from the claim text.