Apparatus for predicting reliability in electronic device package, program for predicting reliability in electronic device package, and method for predicting reliability in electronic device package

A computer readable storage medium for controlling a computer and comprising a program for predicting reliability in an electronic device package by allowing a computer, which includes a package modeling database that stores data concerning the shape of an electronic device package and the specifications for modeling of the electronic device package, and a material database that stores data concerning the properties of a material made into the electronic device package, to function as:

• a parameter designating unit receiving parameters inputted to designate a type of the electronic device package, dimensions thereof, selected material thereof and properties of the material, and conditions for assessment thereof;
• a modeling unit creating a simulation model on the basis of parameters of the properties of the material, and the dimensions of the electronic device package, which are designated by using the inputted parameters;
• a simulation executing unit using the simulation model which is created by the modeling unit, to execute a simulation under the conditions designated by the inputted parameters;
• a results-of-simulation assessing unit assessing the results of a simulation carried out by the simulation executing unit on the basis of a predetermined assessment criterion, and storing and preserving, in a results-of-assessment database, the inputted parameters and the results of assessment which are obtained by assessing the results of a simulation, with regard to each type of the electronic device package;
• an assessment expression generating unit generating, as an assessment expression, an approximate expression, which infers the results of assessment from the inputted parameters, on the assumption that a predetermined amount of the results of assessment is preserved in the results-of-assessment database;
• and
• an assessment predicting unit, when an electronic device package in which the assessment expression has already been established is designated by using the inputted parameters, outputting the results of an assessment prediction according to the assessment expression;
• wherein
• an orthogonal polynomial expression, based on a design of experiments method, is used to generate an initial assessment expression in establishing the assessment expression, and the assessment expression is updated on the basis of the least squares method;
• when a number of combinations of the inputted parameters and the results of assessment obtained by carrying out a simulation which is concerned with the same type of electronic device package exceeds a number of the inputted parameters, comprising a sum of the number of the inputted parameters representing dimensions, a number of material properties, and a number of conditions for a load, an assessment expression generating unit produces an assessment expression (E) as an approximate expression that makes the inputted parameters approximate the results of assessment, the assessment expression production unit being implemented by running a predetermined program, residing in the computer system, wherein maximum stress SA is approximated by a quadratic polynomial expression, or an orthogonal polynomial expression, as follows:
• SA≅a0+a1x+a2x2+b1y+b2y2+. . . +d1ΔT+d2(ΔT)2
• wherein ΔT denotes difference in temperature, a0, a1, a2, b1, b2, etc., d1, and d2 denote unknown coefficients, as to which, if a number of combinations of the inputted parameters and the results of assessment of the maximum stress SA, which is the same as the number of unknown coefficients, is obtained, the unknown coefficients are uniquely determinable and, if the number of the above combinations exceeds the number of unknown coefficients, the unknown coefficients are predictable according to the least squares method.

A method for predicting reliability in an electronic device package by using a computer, which includes a package modeling database that stores data concerning the shape of an electronic device package and the specifications for modeling of the electronic device package, and a material database that stores data concerning the properties of a material made into the electronic device package, comprising:

• receiving parameters inputted to designate a type of the electronic device package, dimensions thereof, selected material and properties of the material thereof, and conditions for assessment thereof;
• creating a simulation model on the selected basis of the inputted parameters of the properties of the material, and the dimensions of the electronic device package, which are designated by using the inputted parameters;
• using the created simulation model, to execute a simulation under the conditions designated by the inputted parameters;
• assessing the results of simulation carried out by executing the simulation on the basis of a predetermined assessment criterion, and storing and preserving, in a results-of-assessment database, the inputted parameters and results of assessment which are obtained by assessing the results of a simulation, with regard to each type of the electronic device package;
• generating, as an assessment expression, an approximate expression, which infers the results of assessment from the inputted parameters, on the assumption that a predetermined amount of the results of assessment is preserved in the results-of-assessment database;
• and
• outputting the results of an assessment prediction according to the assessment expression, when an electronic device package in which the assessment expression has already been established is designated by using the inputted parameters;
• wherein
• an orthogonal polynomial expression, based on a design of experiments method, is used to generate an initial assessment expression in establishing the assessment expression, and the assessment expression is updated on the basis of the least squares method;
• when a number of combinations of the inputted parameters and the results of assessment obtained by carrying out a simulation which is concerned with the same type of electronic device package exceeds a number of the inputted parameters, comprising a sum of the number of the inputted parameters representing dimensions, a number of material properties, and a number of conditions for a load, an assessment expression generating unit produces an assessment expression (E) as an approximate expression that makes the inputted parameters approximate the results of assessment, the assessment expression production unit being implemented by running a predetermined program, residing in the computer system, wherein maximum stress SA is approximated by a quadratic polynomial expression, or an orthogonal polynomial expression, as follows:
• SA ≅a0+a1x+a2x2+b1y+b2y2+. . . +d1ΔT+d2(ΔT)2
• wherein ΔT denotes difference in temperature, a0, a1, a2, b1, b2, etc., d1, and d2 denote unknown coefficients, as to which, if a number of combinations of the inputted parameters and the results of assessment of the maximum stress SA, which is the same as the number of unknown coefficients, is obtained, the unknown coefficients are uniquely determinable and, if the number of the above combinations exceeds the number of unknown coefficients, the unknown coefficients are predictable according to the least squares method.