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US 7,467,059 B2Granted
Extended thermal management
AssigneeIntel Corporation
InventorsGuy M. Therien, Robert T. Jackson
Life of this patent
Estimating the term…
Abstract
A method for managing thermal condition of a thermal zone that includes multiple thermally controllable components include determining thermal relationship between the components and reducing temperature of a first component by reducing thermal dissipation of a second component.
Claims20
A method, comprising:
- dynamically during runtime determining a thermal influence a second component has on a first component is greater than a thermal influence a third component has on the first component;
- and
- dynamically during runtime managing a thermal condition of the first component based on the determination by adjusting a thermal condition of the second component in the thermal zone to reduce a temperature of the second component instead of adjusting a thermal condition of the third component to reduce the temperature of the third component, wherein at least one of the first component, the second component, and the third component is a processor.
A method, comprising:
- receiving dynamically during runtime a signal from a first component in a thermal zone during a first time period, the signal indicating that a thermal condition of the first component is crossing a trip point;
- identifying dynamically during runtime a second component in the thermal zone, wherein a thermal condition of the second component has been determined to have more impact on cooling the first component than a thermal condition of a third component;
- and
- managing dynamically during runtime the thermal condition of the first component based on the determination by managing the thermal condition of the second component to reduce a temperature of the second component, wherein at least one of the first component, the second component, and the third component is a processor.
1 more element
A system, comprising:
- a policy manager to use the data to manage thermal condition of the first component and the second component, wherein each of the first component and the second component includes a thermal interface configured to provide its thermal properties, wherein the policy manager is to reduce a thermal dissipation of the second component in response to receiving a signal from the first component, and wherein at least one of the first component and the second component is a processor;
- data describing a thermal influence a second component and a third component on a first component, wherein the first second and third components each are configured with a thermal interface to provide thermal properties;
- and
- a policy manager to, dynamically during runtime,
- use the data to determine the thermal influence the second component has on the first component is greater than the thermal influence the third component has on the first component;
- and
- manage a thermal condition of the first component based on the determination by adjusting a thermal condition of the second component to reduce a temperature of the second component instead of adjusting a thermal condition of the third component to reduce the temperature of the third component,
- wherein at least one of the first component, the second component, and the third component is a processor.
5 more elements
Dependencies are inferred from the claim text.