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US 7,466,733 B2Granted
Optical device chip, and optical module and method for manufacturing the same
AssigneeSeiko Epson Corporation
InventorTetsuo Nishida
Life of this patent
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Abstract
An optical device chip includes: a first semiconductor layer of a first conductivity type; an optical layer that emits light or receives light formed above the first semiconductor layer; a second semiconductor layer of a second conductivity type formed above the optical layer; a first electrode electrically connected to the first semiconductor layer; a second electrode electrically connected to the second semiconductor layer; and a connecting section that short-circuits the first electrode and the second electrode.
Claims1
An optical module comprising:
- a supporting member;
- and
- an optical device chip mounted on the supporting member,
- wherein the optical device chip includes:
- a first semiconductor layer of a first conductivity type;
- an optical layer that emits light or receives light formed above the first semiconductor layer;
- a second semiconductor layer of a second conductivity type formed above the optical layer;
- a first electrode electrically connected to the first semiconductor layer;
- a second electrode electrically connected to the second semiconductor layer;
- a first conductive section protruding from a pad section of the first electrode;
- and a second conductive section protruding from a pad section of the second electrode, wherein the first conductive section and the second conductive section are composed of a material different from a material of the first electrode and the second electrode, the first conductive section protrudes toward the second conductive section, and the second conductive section protrudes toward the first conductive section.
8 more elements
Dependencies are inferred from the claim text.