Apparatus for air cooling of an electronic device
AssigneeApple Inc.
InventorsSteven Holmes, Douglas L. Heirich
Life of this patent
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Abstract
An apparatus for air-cooling an electronic device is disclosed. A contoured panel channels a flow of air within the housing of an electronic device so as to channel the flow of air more directly over heat producing elements such as the microprocessor and peripheral cards. A sensor can also be employed to determine whether the panel is present and properly placed. If not, measures can be taken to reduce the heat generated by the heat producing elements. For example, a warning can be displayed, or the microprocessor can be instructed to enter sleep mode.
Claims20
A contoured panel for directing a flow of air within an electronic device, comprising:
- a panel configured to be removably placed proximate to an electronic device, the electronic device having an outer housing, a heat producing element and a fan, the panel further having a contoured portion configured to be placed proximate to the fan so as to direct a flow of air from the fan across the heat producing element, the flow of air facilitating the cooling of the heat producing element, wherein the panel is configured to be removably placed across an opening of said outer housing such that it substantially covers said opening.
An air-cooled electronic device, comprising:
- a housing having an opening therein;
- a microprocessor and a fan within the housing;
- and
- a panel configured to be removably placed proximate to the housing so as to substantially cover the opening therein, the panel having a contoured portion configured to direct a flow of air from the fan across the microprocessor so as to cool the microprocessor.
An electronic device housing, comprising:
- a first portion configured to support a microprocessor;
- a second portion configured to support a first fan;
- a plurality of outer walls configured to hold electronic device components therein, the plurality of outer walls having an opening therein;
- and
- a removable, contoured panel configured to be placed proximate to the plurality of outer walls so as to substantially cover the opening therein, and also configured to direct air from the first fan across the microprocessor, so as to cool the microprocessor.
Dependencies are inferred from the claim text.