System and method for providing temperature correction in a crystal oscillator

A method for subjecting a oscillator component to a temperature test profile comprising:

• performing a first stage of the temperature test profile by:
• setting the temperature to an initial temperature;
• continuously changing the temperature over a first period of time until a first temperature setting is reached;
• continuously changing the temperature in a reverse direction over a second period of time until a second temperature setting is reached;
• continuously changing the temperature in a reverse direction relative to the direction in the second period of time over a third period of time until a third temperature setting is reached;
• performing a second stage of the temperature test profile by:
• starting with the third temperature setting and changing the temperature in a direction opposite the direction of the temperature change during the third period of time until the second temperature setting is reached;
• then changing the temperature in a direction opposite the direction of the temperature change during the second period of time;
• and
• then changing the temperature in a direction opposite the direction of the temperature change during the first period of time until the initial temperature setting is reached.

A device comprising:

• a plurality of electronic components to perform a function that uses a signal having a frequency;
• a oscillator circuit in a component package that includes a temperature sensing device located in substantially close proximity to the oscillator circuit, where the oscillator circuit generates the frequency used to perform the function, the frequency varying as a function of temperature characterized by a temperature compensation model associated with a plurality of parameters that characterize the component package, the parameters including dynamic response parameters that characterize a thermal dynamic response of the component package;
• a parameter memory for storing the plurality of parameters;
• and
• a frequency correction function coupled to the oscillator component to receive the frequency and to receive a signal indicative of the temperature from the temperature sensing device, the frequency correction function being operable to receive at least some of the plurality of parameters and to perform the temperature compensation model using the plurality of parameters.

A system for configuring a oscillator component for generating a temperature corrected frequency, the system comprising:

• a temperature sensor and a oscillator circuit included in the oscillator component;
• a temperature controlled chamber containing the oscillator component, the temperature controlled chamber controllable to subject the oscillator component to a temperature that varies according to a temperature test profile;
• and
• a temperature correction modeling function coupled to the oscillator component to receive an uncompensated frequency signal and a temperature signal indicative of the temperature of the oscillator component, the temperature correction modeling function operable to model the oscillator component a temperature compensation model associated with a plurality of parameters that characterize the component package, the parameters including dynamic response parameters that characterize a thermal dynamic response of the component package, the temperature compensation modeling function being operable to generate the plurality of parameters:
• frequency=(a0+a1T+a2T2+a3T3+a4T4+ . . . +anTn)+{(b1,0+b1,1T+b1,2T2+b1,3T3+b1,4T4+ . . . +b1,xTx)*(b2,0+b2,1R+ . . . +b2,yRy)}+(c0+c1Tf+ . . . cmTfm)
• where, T=temperature, R=filtered temperature ramp rate, Tf=filtered temperature, and an, bi,x, b2,y, and cm are coefficients calculated by curvefitting frequency and temperature data acquired while subjecting the component package to a temperature test profile, the temperature correction modeling function further operable to associate the coefficients to the oscillator component.