Back to results
US 7,466,018 B2Granted
MEMS device wafer-level package
AssigneeTexas Instruments Incorporated
InventorsThomas A. Kocian, Richard L. Knipe, Mark H. Strumpell
Life of this patent
Estimating the term…
Abstract
A method and system in which a semiconductor wafer having a plurality of dies is inspected through a visual inspection and/or an electrical test. If certain of the dies on the wafer pass the inspection, then windows are mounted or affixed above those certain dies while they are still a part of the wafer.
Claims8
A wafer structure for manufacturing semiconductor devices, the wafer structure comprising:
- a) a semiconductor wafer comprising a plurality of dies;
- b) an adhesive bead affixed to at least one of the plurality of dies;
- b) a window mounted to the at least one die by the adhesive bead, wherein at least one of the plurality of dies does not have a window mounted to it.
Dependencies are inferred from the claim text.