Method for producing a packaged integrated circuit

A system for producing an integrated circuit, said system comprising:

• a substrate having at least one micro-structure suspended above a micro-cavity and having a heating element on said at least one micro-structure capable of heating itself and its immediate surroundings;
• a layer of protective material on said micro-structure such that at least a top surface of said micro-structure and an opening of said micro-cavity is covered, wherein said protective material is in a solid state at room temperature and can protect the micro-structure during silicon wafer dicing procedures and subsequent packaging, and wherein said micro-structure, said micro-cavity, and said protective material provide an unobstructed volume above and below said micro-structure when said micro-structure is subjected to a heat source;
• and
• heating circuitry for passing an electric current through said heating element to generate said heat source to provide said unobstructed volume above and below said micro-structure.

A packaged integrated circuit comprising:

• a substrate having at least one micro-structure suspended above a micro-cavity and a heating element on said micro-structure capable of heating itself and its immediate surroundings;
• a packaging enclosing said substrate;
• a protective layer of material filling said packaging, wherein said protective material is in a solid state at room temperature and can protect said micro-structure during silicon wafer dicing procedures and subsequent packaging;
• an unobstructed volume above said micro-structure and below said micro-structure to provide said micro-cavity;
• and
• heating circuitry for passing an electric current through said heating element to generate a heat source to provide said unobstructed volume above and below said micro-structure.