Three-dimensional multichip module
AssigneeMicron Technology, Inc.
InventorPaul A. Farrar
Life of this patent
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Abstract
A three-dimensional multichip module having a base structure formed by a plurality of chips secured together in a stack and a plurality of exterior chips mounted to the exterior faces of the base structure. The multichip module may incorporate memory chips, processor chips, logic chips, A to D converter chips, and other chips in a compact package. The module permits chips that require extensive cooling to be positioned within the structure in a manner such that a large surface area of the chip is not in contact with other chips. The module also permits extensive interconnection between chips within the module.
Claims15
A method of forming a multichip module, comprising:
- securing together a plurality of semiconductor chips in a manner so as to form a base structure having an upper exterior surface, a lower exterior surface, and a lateral exterior surface, said lateral exterior surface is comprised of a portion of each chip, wherein an insulating material is formed on the upper exterior surface and interposed between at least two adjacent chips in the base structure, wherein said insulating material comprises a polymeric material;
- forming a plurality of conductive contacts on the lateral exterior surface wherein the conductive contacts provide connection between the chips and external circuitry;
- converting at least a portion of the insulating material formed on the upper exterior surface and between two adjacent chips in the base structure to a foamed state;
- and
- securing an exterior chip to the lateral exterior surface wherein a first surface of the exterior chip is positioned adjacent the lateral exterior surface and extends across at least a portion of the lateral exterior surface.
A method of forming a multichip module, comprising:
- stacking together a plurality of semiconductor chips in a manner so as to form a base structure having an upper exterior face, and a lateral face that is comprised of a portion of each chip;
- forming an insulating material on the upper exterior face and between at least two adjacent semiconductor chips in the base structure, wherein said insulating material comprises a polymeric material;
- converting at least a portion of the insulating material to a foamed state;
- and
- mounting an exterior chip to the base structure in a manner such that a face of the exterior chip extends in a plane that is substantially parallel to the lateral face of the base structure;
- and
- electrically connecting the exterior chip to at least one chip in the base structure.
Dependencies are inferred from the claim text.