Quantum device, manufacturing method of the same and controlling method of the same
AssigneeFujitsu Limited
InventorsHaizhi Song, Tatsuya Usuki
Life of this patent
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AssigneeFujitsu Limited
InventorsHaizhi Song, Tatsuya Usuki
Estimating the term…
By bringing a tip of an AFM into contact with the surface of a GaAs substrate or an AlGaAs substrate, for example, applying a negative bias to the tip, and applying a positive bias to the GaAs substrate or the AlGaAs substrate, a donut-shaped oxide film is formed. Then, the oxide film is removed. As a result, a ring-shaped groove is formed in the surface of the GaAs substrate or the AlGaAs substrate. The oxide film can be removed by chemical etching, ultrasonic cleaning with water, a treatment with atomic hydrogen in a vacuum, or the like. Thereafter, a semiconductor film (InAs film or InGaAs film, for example) is epitaxially grown in the groove. Then, a capping layer which covers the semiconductor film and the GaAs substrate or the AlGaAs substrate is formed.
A manufacturing method of a quantum device, comprising the steps of:
A manufacturing method of a quantum device, comprising the steps of:
A controlling method of a quantum device comprising a qubit which includes a quantum ring, a single nuclear spin surrounded by the quantum ring, and a quantum dot adjacent to the quantum ring, said controlling method comprising:
A manufacturing method of a quantum device, comprising the steps of:
A manufacturing method of a quantum device, comprising the steps of:
Dependencies are inferred from the claim text.