Measurement of a sample using multiple models
AssigneeNanometrics Incorporated
InventorsYe Feng, Zhuan Liu
Life of this patent
Estimating the term…
Loading patent…
AssigneeNanometrics Incorporated
InventorsYe Feng, Zhuan Liu
Estimating the term…
A sample that is processed to remove a top layer, e.g., using chemical mechanical polishing or etching, is accurately measured using multiple models of the sample. The multiple models may be constrained based on a pre-processing measurement of the sample. By way of example, the multiple models of the sample may be linked in pairs, where one pair includes a model simulating the pre-processed sample and another model simulating the post-processed sample with a portion of the top layer remaining, i.e., under-processing. Another pair of linked models includes a model simulating the pre-processed sample and a model simulating the post-processing sample with the top layer removed, i.e., the correct amount of processing or over-processing. The underlying layers in the linked model pairs are constrained to have the same parameters. The modeling process may use a non-linear regression or libraries.
A method comprising:
A method comprising:
Dependencies are inferred from the claim text.