Image transfer process for thin film component definition

A method for fabricating a magnetic head, comprising:

• forming a wafer having a sensor film;
• adding a release layer to the wafer above the sensor, the release layer being soluble in a solvent;
• forming a layer of photoresist above the release layer;
• processing the layer of photoresist to define a pattern, the patterned layer of photoresist defining a track width of the sensor film under covered regions of the layers, the covered regions being under the patterned layer of photoresist;
• substantially removing uncovered regions of the release layer;
• substantially removing uncovered regions of the sensor film;
• adding a layer of metal to the wafer;
• baking the wafer at a predetermined temperature for a period of time sufficient to cause deformation of the photoresist to an extent that the photoresist creates cracks in the metal layer;
• applying a solvent to the wafer to dissolve at least a portion of the release layer, the solvent penetrating the cracks in the metal layer to reach the release layer;
• and
• removing portions of the layers above the release layer.