Sputtering target material
AssigneeIshifuku Metal Industry Co., Ltd.
InventorsKoichi Hasegawa, Nobuo Ishii, Tomoyoshi Asaki
Life of this patent
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Abstract
Provided is a sputtering target material which has a high reflectance and which is excellent in a sulfurization resistance, comprising an Ag alloy prepared by alloying Ag with a specific small amount of the metal component (A) selected from In, Sn and Zn, a specific small amount of the metal component (B) selected from Au, Pd and Pt and, if necessary, a small amount of Cu.
Claims30
A sputtering target material for forming a high corrosion resistant thin film having a high reflectance, consisting of an Ag alloy which consists of a blend of Ag with at least one metal component (A) selected from 0.1 to 2.0 mass % of In and 0.1 to 2.0 mass % of Sn in an amount of 0.1 to 2.0 mass % in total and at least one metal component (B) selected from 0.1 to 0.9 mass % of Au, 0.1 to 4.9 mass % of Pd and 0.1 to 0.9 mass % of Pt in an amount of 0.1 to 4.9 mass % in total and in which the total content of the metal component (A) and the metal component (B) is 0.2 to 5.0 mass %.
A sputtering target material for forming a high corrosion resistant thin film having a high reflectance, consisting of an Ag alloy which consists of a blend of Ag with at least one metal component (A) selected from 0.05 to 2.0 mass % of In and 0.05 to 2.0 mass % of Sn in an amount of 0.05 to 2.0 mass % in total, at least metal component (B) selected from 0.1 to 0.9 mass % of Au, 0.1 to 4.9 mass % of Pd and 0.1 to 0.9 mass % of Pt in an amount of 0.1 to 4.9 mass % in total and 0.05 to 2.0 mass % of Cu and in which the total content of the metal component (A), the metal component (B) and Cu is 0.2 to 5.0 mass %.
A thin film of an Ag alloy which consists of a blend of Ag with at least one metal component (A) selected from 0.1 to 2.0 mass % of In and 0.1 to 2.0 mass % of Sn in an amount of 0.1 to 2.0 mass % in total and at least one metal component (B) selected from 0.1 to 0.9 mass % of Au, 0.1 to 4.9 mass % of Pd and 0.1 to 0.9 mass % of Pt in an amount of 0.1 to 4.9 mass % in total and in which the total content of the metal component (A) and the metal component (B) is 0.2 to 5.0 mass %.
A thin film of an Ag alloy which consists of a blend of Ag with at least one metal component (A) selected from 0.05 to 2.0 mass % of In and 0.05 to 2.0 mass % of Sn in an amount of 0.05 to 2.0 mass % in total, at least one metal component (B) selected from 0.1 to 0.9 mass % of Au, 0.1 to 4.9 mass % of Pd and 0.1 to 0.9 mass % of Pt in an amount of 0.1 to 4.9 mass % in total and 0.05 to 2.0 mass % of Cu and in which the total content of the metal component (A), the metal component (B) and Cu is 0.2 to 5.0 mass %.
Dependencies are inferred from the claim text.