Probe polishing method and probe polishing member
AssigneeTokyo Electron Limited
InventorMasahito Kobayashi
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Abstract
In a probe polishing method, a plurality of probes, which are arranged on a probe card for performing an inspection of electrical characteristics of a target object, are polished by using a polishing member. Further, the probes are polished over plural times, while changing a relative position of the abrasive sheet with respect to the probe card.
Claims19
A probe polishing method for polishing, by using a polishing member, a plurality of probes arranged on a probe card for performing an inspection of electrical characteristics of a target object,
- wherein the probes are divided into multiple groups and the probes are polished on a group-by-group basis by a repeated polishing operation polishing the individual groups successively by changing a relative position of the polishing member with respect to the probe card, and
- wherein the polishing member is mounted on a support installed at a periphery of a movable mounting table for mounting the target object thereon, and the polishing member is moved by using the mounting table.
A method for polishing probes arranged in a probe area of a probe card by using a polishing member, the probe area being lager than the size of the polishing member such that the probe area is not fully covered by the polishing member, comprising:
- dividing the probes in the probe area into multiple groups;
- and
- polishing the probes by performing polishing operation on a group-by-group basis by a repeated polishing operation polishing the individual groups successively, wherein probes in one group are polished simultaneously in one polishing operation,
- wherein the polishing member is mounted on a support installed at a periphery of a movable mounting table for mounting an object to be inspected by the probe card thereon, and the polishing member is moved by using the mounting table.
A method for polishing probes arranged in a probe area of a probe card by using a polishing member, the probe area being larger than the size of the polishing member such that the probe area is not fully covered by the polishing member, comprising:
- dividing the probes in the probe area into multiple groups;
- and
- polishing the probes by performing a repeated polishing operation on a group-by-group basis of respective ones of the groups successively, wherein probes in one group are polished simultaneously in one polishing operation,
- wherein the probe card and the mounting table are installed in a probe apparatus and the polishing operation is performed without separating the probe card and the mounting table from the probe apparatus.
Dependencies are inferred from the claim text.