Back to results
US 7,465,214 B2Granted
Substrate holding apparatus and polishing apparatus
AssigneeEbara Corporation
InventorsTetsuji Togawa, Osamu Nabeya
Life of this patent
Estimating the term…
Abstract
A substrate holding apparatus holds a substrate such as a semiconductor and presses the substrate against a polishing surface. The substrate holding apparatus includes a top ring body (2) for holding the substrate, a plurality of fluid passages (33, 34, 35, 36) for supplying a fluid to a plurality of pressure chambers (22, 23, 24, 25) defined in the top ring body, and a plurality of sensors (S1, S2, S3, S4) disposed in the fluid passages, respectively, for detecting flowing states of the fluid which flows through the fluid passages.
Claims12
A polishing apparatus comprising:
- a polishing table having a polishing surface;
- and
- a substrate holding apparatus for holding a substrate and pressing the substrate against said polishing surface, said substrate holding apparatus comprising:
- a top ring body for holding the substrate, said top ring body having a plurality of pressure chambers defined in said top ring body;
- a plurality of fluid passages for supplying a fluid to said to said plurality of pressure chambers;
- and
- a plurality of sensors disposed in said plurality of fluid passages, respectively, operable to detect at least one of a flow direction of the fluid, a flow velocity of the fluid and a flow rate of the fluid that is supplied to and flows through said plurality of fluid passages.
4 more elements
Dependencies are inferred from the claim text.