Method and apparatus for forming a low profile wire loop
AssigneeKulicke and Soffa Industries, Inc.
InventorStephen E Babinetz
Life of this patent
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Abstract
A method of bonding a wire between a first bonding location and a second bonding location is provided. The method includes bonding a first end of a wire to a first bonding location using a wire bonding tool to form a first wire bond. The method also includes forming a looped portion in the wire adjacent the first wire bond. The method also includes lowering the wire bonding tool in a direction towards the first wire bond after the forming step. The lowering step is interrupted prior to the wire bonding tool contacting the first wire bond. The method also includes bonding a second end of the wire to a second bonding location.
Claims14
A method of bonding a wire between a first bonding location and a second bonding location, the method comprising the steps of:
- bonding a first end of a wire to a first bonding location using a wire bonding tool to form a first wire bond;
- forming a fold of wire on top of, and in contact with, the first wire bond such that the fold of wire includes (1) a first portion extending from the first wire bond in a first direction, (2) a second portion extending in a second direction substantially opposite and substantially parallel to the first direction;
- lowering the wire bonding tool in a direction towards the first wire bond immediately after the forming step, the lowering step being interrupted prior to the wire bonding tool contacting the first wire bond such that the bonding tool does not bond the fold of wire to the first wire bond;
- and
- bonding a second end of the wire to a second bonding location.
A method of bonding a wire between a first bonding location and a second bonding location, the method comprising the steps of:
- bonding a first end of a wire to a first bonding location using a wire bonding tool to form a first wire bond;
- forming a fold of wire on top of, and in contact with, the first wire bond such that the fold of wire includes (1) a first portion extending from the first wire bond in a first direction, (2) a second portion extending in a second direction substantially opposite and substantially parallel to the first direction, the step of forming including in order:
- raising the wire bonding tool above the first wire bond,
- moving the wire bonding tool away from the first wire bond,
- raising the wire bonding tool, and
- moving the wire bonding tool towards the first wire bond, the moving step being interrupted prior to the wire bonding tool contacting the first wire bond such that the bonding tool does not bond the fold of wire to the first wire bond;
- and
- bonding a second end of the wire to a second bonding location.
Dependencies are inferred from the claim text.