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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShih-Ming Chang, Chen-Yuan Hsia, Wen-Chuan Wang, Chi-Lun Lu, Yen-Bin Huang, Chang-Cheng Hung, Chia-Jen Chen, Kai-Chung Liu, Hsin-Chang Lee, Hong-Chang Hsieh
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A system and method are disclosed for monitoring a dimensional change of a pattern for an object having a transparent layer exposed through the pattern and a non-transparent pattern laminated therewith. According to the method, a first beam is projected to the pattern. A second beam resulted from the first beam passing through the transparent layer exposed by the pattern, or from the first beam reflected from the non-transparent layer of the pattern, is detected. A value of a predetermined property from the second beam detected is obtained. A variation of the value is monitored for identifying the dimensional change of the pattern.
A method for monitoring a dimensional change of a pattern for an object having a transparent layer exposed through the pattern and a non-transparent pattern laminated therewith, the method comprising:
A system for monitoring a dimensional change of a pattern for an object having a transparent layer exposed through the pattern and a non-transparent pattern laminated therewith, the system comprising:
A method for monitoring a dimensional change of a pattern for an object having a transparent layer exposed through the pattern and a non-transparent pattern laminated therewith, the method comprising:
Dependencies are inferred from the claim text.