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US 7,460,211 B2Granted
Apparatus for wafer patterning to reduce edge exclusion zone
AssigneeLSI Corporation
InventorsBruce Whitefield, David Abercrombie
Life of this patent
Estimating the term…
Abstract
An apparatus includes an edge expose unit for exposing an annular area in an edge exclusion zone of a wafer to radiation having a wavelength suitable for removing a film from the wafer in the annular area and a radiation modulator coupled to the edge expose unit for modulating the radiation to pattern the film in the annular area.
Claims8
An apparatus comprising:
- an edge expose unit for exposing an annular area in an edge exclusion zone of a wafer to radiation having a wavelength suitable for removing edge films from the wafer, the edge films having stepped edges in the edge exclusion zone;
- and a radiation modulator coupled to the edge expose unit for modulating the radiation to create a continuous pattern around the annular area suitable for shortening a planarization length of the wafer to the stepped edges of the edge films.
Dependencies are inferred from the claim text.